The global EUV Pellicle market was valued at USD 72 million in 2024 and is projected to reach USD 163 million by 2032, growing at a robust CAGR of 9.3% during the forecast period. This growth is fundamentally driven by the semiconductor industry’s rapid transition to Extreme Ultraviolet (EUV) lithography for manufacturing advanced chips at sub-7nm nodes and beyond.
EUV pellicles are ultra-thin, high-transmittance protective membranes essential for shielding multi-million-dollar photomasks from contamination during the EUV lithography process. The technology has evolved from initial polysilicon designs to advanced multi-layer Molybdenum Disilicide/Silicon (MoSi/Si) composites, now achieving over 90% EUV light transmittance (EUVT). The next frontier is Carbon Nanotube (CNT)-based pellicles, which promise even greater thermal stability for next-generation, high-power lithography systems.
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Market Overview & Competitive Landscape
The market is characterized by high technical barriers and strategic collaborations. Asia-Pacific dominates demand, driven by major semiconductor foundries and integrated device manufacturers (IDMs) in South Korea, Taiwan, and Japan. The Foundry application segment is the primary consumer, as leading-edge logic chip production for AI, HPC, and mobile applications fully relies on EUV technology.
Key players are engaged in intense R&D to meet escalating performance requirements. Mitsui Chemicals holds a significant market position through early investment and partnerships. S&S Tech and Canatu are notable competitors focusing on high-transmittance solutions, while semiconductor giants like TSMC are developing in-house capabilities. The landscape is further shaped by equipment leaders like ASML, which actively licenses and co-develops pellicle technology to ensure the viability of its EUV systems.
Key Market Drivers and Opportunities
- Adoption of EUV for Advanced Nodes: Over 90% of leading-edge logic chips are now manufactured using EUV lithography, creating non-negotiable demand for pellicles to protect masks from yield-killing defects.
- Transition to Higher Power Systems: The shift to EUV sources exceeding 500W necessitates pellicles with superior thermal and mechanical durability, driving innovation and premium solutions.
- Consumable Nature & Replacement Cycle: Pellicles require replacement every 2-6 months, creating a sustainable, recurring revenue stream aligned with wafer start volumes.
- Emerging CNT Technology: Carbon nanotube-based pellicles represent a major growth frontier, offering potential transmittance above 93% and enhanced durability for 600W+ systems.
- Expansion into Advanced Packaging: New applications in 2.5D/3D packaging using EUV lithography are opening additional demand channels beyond front-end logic.
Challenges & Restraints
- Extreme Material Science Complexities: Manufacturing defect-free membranes thinner than 50nm that can withstand intense EUV energy pushes the boundaries of current technology, impacting yields and production scalability.
- Consolidated Ecosystem & Long Qualification: Dependency on a narrow EUV equipment ecosystem leads to prolonged technical certification cycles (12-18 months), slowing time-to-market for new innovations.
- High R&D and Capital Intensity: Developing next-generation pellicles requires immense investment in advanced R&D and specialized cleanroom facilities, creating high entry barriers.
- Supply Chain Concentration: Geopolitical factors and the concentrated supplier base introduce risks to the secure supply of these critical materials.
Market Segmentation Analysis
- By Type: The ≥90% Transmittance segment dominates, as advanced node manufacturing requires maximum photon delivery for precision patterning.
- By Application: The Foundry segment leads consumption, fueled by the pure-play foundry model for cutting-edge chip manufacturing.
- By Material: MoSi/Si multilayer composites are the current industry standard, balancing high EUVT with durability. CNT films are the high-growth future segment.
- By Technology Generation: Current-generation (MoSi/Si multilayer) films hold the largest share, while Next-generation (CNT-based) solutions are poised for rapid adoption.
Key Companies Profiled
The report provides detailed analysis on major players, including:
- Mitsui Chemicals
- S&S Tech
- Canatu
- TSMC
- FST
- ASML
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Report Scope
This comprehensive report provides an in-depth analysis of the global EUV Pellicle market from 2024 to 2032. It includes:
- Detailed market size, growth projections, and trend analysis.
- Granular segmentation by Type, Application, Material, Technology Generation, and Region.
- Production and demand analysis across key geographies (North America, Europe, Asia-Pacific, etc.).
- Competitive landscape assessment, including company profiles, market shares, and strategic initiatives.
- Thorough evaluation of market drivers, restraints, opportunities, and supply chain dynamics.
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