KUALA
LUMPUR – August 7, 2025
– We are honoured to
invite you to participate in the inaugural Institute of Future Technology
and Design (IFTD) Forum and Workshops, a groundbreaking collaboration
between HELP University and China’s top-ranked packaging institution, Hunan
University of Technology (HUT). This pioneering initiative represents a
strategic alliance to advance innovation, sustainability, and human-centric
development in the circular economy.
About the IFTD Partnership
In 2025, HUT and
HELP University are launching the Institute of Future Technology and Design
(IFTD) at HELP University—establishing Southeast Asia’s premier hub for
sustainable packaging R&D and talent cultivation. This collaboration unites
China’s #1 packaging technology institution with Malaysia’s innovative
educational leader to address one of our era’s most critical challenges:
rethinking packaging and design for ecological resilience, technological
progress, and inclusive growth.
Forum Themes and Focus Areas
Our Forum and
Workshops will explore seven key themes that merge ecology, technology, and
creativity to replace linear waste with circular regeneration. The sessions
will cover a range of topics, from Sustainable Materials & Eco-Design,
focusing on bio-based and recyclable innovations, to Smart Packaging
that utilises technologies like QR/RFID, sensors and supply-chain transparency.
We’ll also explore Circular Design, assessing product lifecycle assessment
and regenerative systems; AI & Green Manufacturing, which focuses on
automation, digital twins and low-energy production; and Consumer Engagement,
exploring branding, ethics, and sustainable behaviour. Additionally, the
discussions will address Policy & Governance, including EPR, and
public-private models, and Talent Development, focusing on the
future-ready, cross-disciplinary training.
Strategic Objectives and Regional Impact
The forum aims to
drive transformation across four critical areas, such as Talent Development
by equipping the next generation of sustainability leaders, and on Business
Transformation by converting circular packaging into competitive advantage.
The event will also explore Technology Adoption, which will look into scaling
AI, IoT, and automation for eco-innovation, and finally, it will also address Ecological
Repair, concentrating on designing systems that restore nature.
Our vision extends
beyond national boundaries. Malaysia and ASEAN, positioned at the nexus of
China’s industry and regional dynamism, can lead Asia’s green transformation in
alignment with national and regional sustainability goals. This Forum
represents Malaysia’s opportunity to play a central role in the ecology of
technology design and packaging.
Partnership Opportunities
The IFTD Partnership
offers unprecedented collaboration opportunities in co-developing courses in
packaging innovation and sustainability, Credit transfer, degree collaboration,
exchanges, and joint laboratories, a China-Malaysia innovation corridor for
R&D and startups as well as training and study visits to China’s AI
institutions and technology hubs.
Your Participation Matters
As a leader in the
design technology and packaging industry, your expertise and perspective are
invaluable to achieving our shared vision. The Forum provides an exceptional
platform to connect globally with academia, industry, and government
leaders across borders. It also serves as an opportunity to showcase innovation
by presenting cutting-edge research in design, packaging, and
sustainability. It also provides a platform to build partnerships by developing
strategic alliances for circular economy solutions, access to talents with
connections to the next generation of sustainability professionals, and lastly,
the opportunity to influence policy to shape the future of sustainable
packaging standards and practices.
Leadership and Vision
Under the visionary leadership
of Hunan University of Technology and
HELP University , this initiative represents more than a forum—it seeds a
future where packaging regenerates, technology serves ecology, and
collaboration builds a humane, sustainable world.
Event Details
Forum: The Application of AI in the Design Industry
Date: August 23, 2025
Time: 9:00 AM – 1:00 PM
Venue: Level 4, Auditorium, Wisma CL,
Kuala Lumpur
Speaker: Prof. Heping Zhu, Dean of the
College of Packaging Design and Art at Hunan University of Technology
Fees: RM200 (+8% SST) = RM216
Workshop 1: AI Applications to Improve Productivity and Profitability (2
Days)
Date: August 25-26, 2025
Time: 9:30 AM – 5:30 PM
Venue: Level 9, HELP University, ELM
Business School, Kuala Lumpur
Fees: RM2,500 (+8% SST) = RM2,700
EARLY BIRD (register before
August 15, 2025): 50% discount
Workshop 2: Use of Technology for Sustainable Packaging (3 Days)
Date: August 25-27, 2025
Time: 9:30 AM – 5:30 PM
Venue: Level 9, HELP University, ELM
Business School, Kuala Lumpur
Fees: RM5,500 (+8% SST) = RM5,940
EARLY BIRD (register before
August 15, 2025): 50% discount
Exhibition: Award-Winning Concepts in Eco-Design, Smart Packaging and
Circular Innovation (From HUT’s School of Packaging Design & Art)
Date: August 23-27, 2025
Time: 9:30 AM – 5:30 PM
Venue: Level 4, Wisma CL, Kuala Lumpur
Fees: Free of Charge
Special Offer: Participants who register for either
Workshop 1 or Workshop 2 are entitled to attend the Forum free of charge.
Take advantage of
our Early Bird offer—register before August 15, 2025, and save 50% on all paid
events!
For registration and
inquiries:
Dr. Fiona: 017-306 6300
Dr. Alice Lim: 012-332 0179
Ms. Liz Quah: 012-267 2378
(Press Release)
